Samsung to Strengthen AI Chip Ecosystem with Local Fabless Companies
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Samsung to Strengthen AI Chip Ecosystem with Local Fabless Companies
  • BK Min
  • 승인 2024.06.28 11:59
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Samsung Electronics fosters a collaborative environment by partnering with domestic fabless companies to enhance the AI chip and system semiconductor ecosystem. According to industry sources, on the 28th, Samsung will hold the "Samsung Foundry Forum 2024" and "SAFE (Samsung Advanced Foundry Ecosystem) Forum 2024" on July 9 at COEX in Gangnam, Seoul.

The annual "Samsung Foundry Forum" introduces semiconductor process technology roadmaps and showcases Samsung's foundry business competitiveness. The forum is held sequentially in the U.S., Korea, Japan, and Europe. The "SAFE Forum," initiated in October 2019, focuses on technology collaboration and networking among partners.

Choi Si-young, head of Samsung Electronics Foundry Business, delivered the keynote address at the "Samsung Foundry Forum 2024," held in Silicon Valley, USA, on the 12th (local time)

During this year's Foundry Forum, keynote speeches will be delivered by Samsung Foundry Business President Choi Si-young, Telechips CEO Lee Jang-gyu, Above Semiconductor Vice President Park Ho-jin, and Rebellion CTO Oh Jin-wook. They will discuss automotive semiconductors, collaboration with Samsung Foundry, and AI semiconductors. Samsung's Device Solutions (DS) division executives will also present on AI solutions, design platforms, and business and customer-related topics.

At the event, Samsung is set to unveil groundbreaking AI semiconductor technology strategies, emphasizing a "one-stop service" for AI chip production across foundry, memory, and advanced packaging (AVP) businesses. They will also showcase significant achievements and plans in AI and low-power semiconductor collaboration with major domestic fabless companies.

Previously, at the Silicon Valley Foundry Forum on June 13, Samsung announced ambitious plans to strengthen its one-stop turnkey service for AI chip production by 2027, integrating foundry, memory, and advanced packaging into a "one team" approach. This integrated AI solution aims to simplify customer supply chains by offering high performance, low power consumption, and high bandwidth.

Additionally, Samsung plans to introduce a 2-nanometer (nm) process with backside power delivery (BSPDN) technology by 2027. Currently, Samsung is mass-producing chips using 3nm Gate-All-Around (GAA) technology and plans to begin mass production of the second-generation 3nm process in the latter half of this year.

Choi Si-young stated, "The most important factor in the AI era is high-performance, low-power semiconductors that enable AI implementation. We will provide one-stop AI solutions optimized for the AI era through the GAA process and optical device technology."

At the SAFE Forum, Samsung Foundry Business Design Platform Development VP Kye Jong-wook and Synopsys EDA Group General Manager Shankar Krishnamoorthy will discuss the future of chip and system design technologies necessary for the AI era.

The summary of this article in Korean is as follows.

▷삼성전자, '삼성 파운드리 포럼 2024' 개최...AI 전략 대거 공개

삼성전자가 국내 팹리스와 협력해 AI 칩 및 시스템 반도체 생태계를 강화한다고 28일 밝혔다.

삼성전자는 다음 달 9일 서울 코엑스에서 '삼성 파운드리 포럼 2024'와 'SAFE 포럼 2024'를 개최한다. 파운드리 포럼에서는 최시영 사장과 주요 파트너사 대표들이 반도체 공정 기술 로드맵과 협력 성과를 발표하며, SAFE 포럼에서는 기술 협업과 네트워킹이 이뤄진다.

이번 행사에서 삼성전자는 AI 반도체 기술 전략을 공개하고, 파운드리, 메모리, 어드밴스드 패키지 사업을 포함한 '원스톱 서비스'를 강조할 예정이다. 또한 국내 팹리스 기업들과의 AI·저전력 반도체 협력 성과와 향후 계획도 발표된다.

삼성전자는 2027년까지 AI 칩 생산을 위한 원스톱 턴키 서비스를 강화하고, 2나노 공정에 '후면전력공급' 기술을 도입할 계획이다. 현재 삼성전자는 3나노 공정에 GAA 기술을 적용해 양산 중이며, 올해 하반기에는 2세대 3나노 공정 양산을 시작할 예정이다.

By_BK Min, KDFN
kdf@kdfnews.com
Source_ⓒSamsung Elec


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